a Department of Mechanical and Automation Engineering National Kaohsiung First University of Science and Technology, Kaohsiung, Taiwan, R.O.C. b Far East University, Tainan, Taiwan, R.O.C.
This research investigates a new micro-hole lapping method by use of the stable zirconia for the material remove model, lapping mechanism and the optimal process parameters. It is assumed that the material is removed in brittle fractures and that the impact force and friction force of a reciprocated piano wire are considered as the major mechanism for removing material. An empirical material remove model including parameters of abrasive size, abrasive concentration of slurry, taper angle of wire, wire tension and pH-value of slurry is derived. The design of experiment and the regression analysis are conducted to formulate the empirical correlation between the significant parameters and the material remove rate. The results show that both the empirical and theoretical models have good agreements with the experimental results and that the material remove rate increases with the abrasive size, wire tension and pH-value of slurry while the material remove rate decreases as the concentration of abrasive or taper angle of wire increases. The experiment result shows that the significant parameters affecting the material remove rate are abrasive size, wire tension and that pH-value of slurry and concentration of abrasive and taper angle of wire are insignificant.
Keywords: Micro-hole lapping; hard and brittle material; response surface method.
Share this article with your colleagues
REFERENCES
[1] Pei, Z.J. and Prabhakar, D. 1995. A Mechanistic Approach to the Prediction of Material Remove Rates in Rotary Ultrasonic Machining. Transactions of the ASME, 117: 142-150.
[2] Wang, H.M.S. 1998. “Analysis of The Effect of Process Parameters on Material Remove Rate in Ultrasonic Machining”. Thesis of Doctor Degree, Lehigh University.
[3] Wang, Z.Y. and Rajurkar, K.P. 1996. Dynamic Analysis of the Ultrasonic Machining Process. Transactions of the ASME, 118: 376-381.
[4] Lee, T.C. and Chan, C.W. 1997. Mechanism of the Ultrasonic Machining of Ceramic Composites. Journal of Materials Processing Technology, 71: 195-201.
[5] Pei, Z.J. and Ferreira, P.M. 1998. Modeling of Ductile-Mode Material Remove in Rotary Ultrasonic Machining. International Journal of Machine Tools & Manufacture, 38: 1399-1418.
[6] Zhang, Q.H. and Zhang, J.H. 1999. Material-Remove-Rate Analysis in the Ultrasonic Machining of Engineering Ceramics. Journal of Materials Processing Technology, 88: 180-184.
[7] Wiercigroch, M. and Neilson, R.D. 1999. Material Remove Rate Prediction for Ultrasonic Drilling of Hard Materials Using an Impact Oscillator Approach. Physics Letters, 91-96.
[8] Wang, A., Cheng and Yan, B. H. 2002. Use of Micro Ultrasonic Vibration Lapping to Enhance the Precision of Microholes Drilled by Micro Electric Discharge Machining. International Journal of Machine Tools & Manufacture, 42: 915-923.
[9] Kao, I. 2004. Technology and Research of Slurry Wire-Saw Manufacturing Systems in Wafer Slicing with Free Abrasive Machining. International Journal of Advanced Manufacturing Systems, 7: 7-20.
[10] Tsai, M. Y. and Yan, L. W. 2010. Characteristics of Chemical Mechanical Polishing using Impregnated Pad. International Journal of Machine Tools & Manufacture, 50, 12: 1031-1037.
[11] Liedke, T. and Kuna, M. 2011. A Macroscopic Mechanical Model of Wire Sawing Process. International Journal of Machine Tools & Manufacture, 51, 9: 711-7.
[12] Pei Z.J. and Billingsley S.R. 1999. Grinding Induced Subsurface Cracks in Silicon Wafers. International Journal of Machine Tools & Manufacture, 39:1103-1116.
[13] Ajayi, O.O. and Ludema, K.C. 1988. Surface Damage of Structural Ceramics: Implications for Wear Modeling. Wear, 124: 237-257.
[14] William Andrew Publishing, Marinescu, Ioan D. and Tonshoff, Hans K. 1999. “Handbook of Ceramic Grinding and Polishing”, Norwich, New York.
[15] Winn, A.J. and Yeomans, J.A. 1996. A Study of Microhardness Indentation Fracture in Alumina Using Confocal Scanning Laser Microscopy. Philosophical Magazine A, 74, 5:1253-1263.
[16] Sakaino, K. and Kawabata, Y. 2000. Etching Characteristics of Si(100) Surfaces in an Aqueous NaOH Solution. Journal of The Electrochemical Society, 147, 4: 1530-1534.
[17] Fang, Q. and Sidky, P. S. 1997. The Effect of Corrosion and Erosion on Ceramic Materials. Corrosion Science, 39, 3: 511-527.
ARTICLE INFORMATION
Received: 2011-09-06 Revised: 2012-02-01 Accepted: 2012-02-26 Available Online: 2012-09-01
Cite this article:
Su, C.-T., Liu, C.-K., Lie, K.N. 2012. Mechanism analysis and process optimization of micro-hole lapping of hard and brittle materials. International Journal of Applied Science and Engineering, 10, 209–226. https://doi.org/10.6703/IJASE.2012.10(3).209
